5G Advanced /6G Circuit & Module Design

New RF and Microwave design workflows for 5G advanced/6G with AI automation

This webinar will be delivered in 3 separate live sessions across regions.
June 17: Europe | 11:00 AM CET; Americas | 10:00 AM Pacific
June 18: Asia | 10:00 AM Seoul / 11:00 AM Beijing

6G technology requires employs sub-THz frequencies (100GHz to 300GHz) to deliver data rates  which are 50x that of 5G. Dense deployment of 6G base stations with integrated phased array beamforming places huge demands for integrated 6G RF modules. Unlike traditional RF & microwave design flows that revolve around separate technologies (Si & III-V RF chips, chip packaging, PCB and printed antennas), the parasitics effects at 6G frequencies and multiple stringent specs that must be simultaneously met requires a complete revamp of the RF & microwave design workflow to enable co-designing and co-optimizing chip, off-chip packaging, and integrated antennas together.

This webinar provides you the knowledge to plan for the optimal deployment of RF & microwave EDA design methodologies for Advanced 5G & 6G that must include the fast-evolving capabilities of AI and to mitigate the scarcity of RF talents from retiring experienced RF engineers.

Participants will learn how:

  • How traceability of design data origin from on-chip, off-chip packaging, PCB and integrated antenna can be assured in the revamped AI enabled RFMW workflow for surgical troubleshooting and confidence in manufacturing sign-off
  • How AI copilots can automate tasks from routine impedance matching and filtering, to orchestrating full scale multi-domain circuit-EM-Electrothermal simulation and optimization with design decision trees. This automation frees the RFMW designer to tackle complex design iterations without being distracted by complex EDA tool setup.
  • How Open Python API enabled RFMW workflows can capture design experience and methodologies as IP for reuse and future agentic AI training.

This webinar is ideal for current and future RF-MW-mmW circuit designers who need the prerequisite knowledge to use new AI enabled RFMW workflows to accomplish designs that were not possible before.

Speaker

How‑Siang Yap

Product Manager and Product
Planning & Marketing Manager at Keysight Technologies

How‑Siang Yap is a seasoned Product Manager and Product Planning & Marketing Manager at Keysight Technologies, bringing extensive expertise in RF, microwave, and EDA (Electronic Design Automation) software solutions. Based in Santa Rosa, California, he has played a pivotal role in shaping Keysight’s RF & Microwave EDA product strategy. How‑Siang is an industry author and thought leader. Recognized for his deep technical proficiency in RF simulation, EDA product strategy, How‑Siang continues to serve as a trusted voice in the RF and microwave engineering community. His work supports Keysight’s mission of enabling next‑generation electronic design through innovative measurement and simulation tools.