Author: 6GWorld

Journalist since eight years old, when I would read the newspaper out loud and pretend it was a radio show. Based in Philadelphia, I have worked for tech companies and in the telecoms industries for over 20 years.

US to Invest $ 1.6 Billion in Advanced Packaging Research

The US Department of Commerce announced it will open competition for funding to conduct research in semiconductor advanced packaging. The R&D activities will be held under the CHIPS program, and will aim to establish and accelerate domestic capacity. According to the Department’s Notice of Funding Opportunity (NOFO), the budget should reach around $1.6 billion. Each […]